SUNNYVALE, Calif., Nov. 06, 2017 (GLOBE NEWSWIRE) -- AMD (NASDAQ:AMD) today announced that it designed a semi-custom graphics processor unit (GPU) that will be integrated into a new Intel multi-chip processor package. The new product, designed by Intel, integrates an Intel® Core™ processor, semi-custom Radeon™ graphics chip, and second generation High Bandwidth Memory (HBM2) into a single package.
“Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics,” said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. “Together, we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.”
Intel expects the new product to launch in the first quarter of 2018. For additional information on the product, see: https://newsroom.intel.com/edito ... leek-thin-devices/.
原帖由 qcmadness 於 2017-11-7 07:05 發表
https://www.techpowerup.com/238542/intel-amd-mcm-core-i7-design-specs-benchmarks-leaked
1536 (24x64) shaders @ 1-1.2GHz
4GB HBM2 @ 700-800MHz
果然唔會同APU同一level
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