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MediaTek and Qualcomm both are moving to fabricate their next-generation mobile SoCs with advanced process nodes in 2019 that will support more advanced technologies, as they aim to maintain their sales momentum and ASPs to tide over a period full of uncertainty over replacement demand in the smartphone market before the arrival of the 5G era, according to industry sources.

While already adding an array of AI-based functionalities infused with its in-house developed tri-cluster and heterogeneous computing technologies, MediaTek reportedly will continue to upgrade its Helio P- and Helio A-series application processors in 2019, with some models to target the high-end smartphone segment, said the sources.

MediaTek is slated to roll out is Helio M70 5G modem chips in the first quarter of 2019, built using a 7nm process at Taiwan Semiconductor Manufacturing Company (TSMC).

MediaTek claimed that it is striving to come out with mobile chip solutions that feature high performance capability, lower power consumption, totally AI-centric and high price/performance ratios that will help clients upgrade to higher market segments.

At the same time, Qualcomm is also implementing a comprehensive upgrade program by adding AI-centric functionalities into its Snapdragon 800, 700, 600 and 400 series CPUs, the sources noted.

Qualcomm has also decided to build its next-generation high-end solutions with a 7nm process at TSMC in order to pursue high price/performance ratios for its new chips, while continuing to fabricate the SoCs for the entry-level and mid-range smartphones with a 11nm process at Samsung Electronics, the sources added.

Qualcomm has also vowed to cope with customized demand by rolling out integrated 5G solutions with antennas and modems, which in turn will help shore up the ASPs of its 5G chips, said the sources.