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標題: [硬件] XB 360底皮再更新，3春PPC同Xenos in same package [打印本頁]

作者: Aware 時間: 2010-3-18 16:58 標題: XB 360底皮再更新，3春PPC同Xenos in same package

http://japanese.engadget.com/201 ... 0-cpu-gpu-valhalla/
新板好似發熱再低啲聽講可以更有效預防RRoD喎

作者: qcmadness 時間: 2010-3-18 17:00

PowerPC based Xenon係用開SOI
R500 Xeons係用開bulk

唔通搵GF做?

作者: Aware 時間: 2010-3-18 17:08

引用:

Originally posted by qcmadness at 2010-3-18 17:00:
PowerPC based Xenon係用開SOI
R500 Xeons係用開bulk

唔通搵GF做?

真係唔知佢點玩，唔通MCP？

不過就咁MCP唔改制程得唔得架。

作者: qcmadness 時間: 2010-3-18 17:09

引用:

Originally posted by Aware at 2010-3-18 17:08:

真係唔知佢點玩，唔通MCP？
不過就咁MCP唔改制程得唔得架。

MCM?

有可能, 但走線做死人

作者: Aware 時間: 2010-3-18 17:21

引用:

Originally posted by qcmadness at 2010-3-18 17:09:

MCM?

有可能, 但走線做死人

M$大把錢，做死係你既事

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