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標題: [電子電玩] Wii U Teardown [打印本頁]

作者: qcmadness 時間: 2012-11-19 22:11 標題: Wii U Teardown

http://www.anandtech.com/show/6465/nintendo-wii-u-teardown

真係3手科技

作者: Puff 時間: 2012-11-19 22:17

I don't understand why Anand can tell people that there are three separate chips named eDRAM, CPU and GPU on the MCM package.

作者: lctang 時間: 2012-11-20 09:42

引用:

原帖由 Puff 於 2012-11-19 22:17 發表
I don't understand why Anand can tell people that there are three separate chips named eDRAM, CPU and GPU on the MCM package.

if one cheap package on board. it will easily define to according spec.

作者: 符碌 時間: 2012-11-20 10:51

仲差過手機

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