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SUNNYVALE, Calif., Nov. 06, 2017 (GLOBE NEWSWIRE) -- AMD (NASDAQ:AMD) today announced that it designed a semi-custom graphics processor unit (GPU) that will be integrated into a new Intel multi-chip processor package. The new product, designed by Intel, integrates an Intel® Core™ processor, semi-custom Radeon™ graphics chip, and second generation High Bandwidth Memory (HBM2) into a single package. “Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics,” said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. “Together, we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.” Intel expects the new product to launch in the first quarter of 2018. For additional information on the product, see: https://newsroom.intel.com/edito ... leek-thin-devices/.
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吹水部屋OC Team
原帖由 dom 於 2017-11-7 02:18 發表 喂呀..........咁我點呀? 用 Intel 都有 AMD inside 邊粒8代先? Coffeelake 定 Icelake
吹水大王
原帖由 qcmadness 於 2017-11-7 07:05 發表 https://www.techpowerup.com/238542/intel-amd-mcm-core-i7-design-specs-benchmarks-leaked 1536 (24x64) shaders @ 1-1.2GHz 4GB HBM2 @ 700-800MHz 果然唔會同APU同一level
原帖由 tat0801 於 2017-11-7 08:07 發表 一樣AMD 就唔洗出APU 但AMD 都仲未拎到呢代APU 出黎...