qcmadness

http://www.anandtech.com/show/48 ... field-and-one-other

引用:

The goal of Medfield seems to have shifted to simply finding itself in a smartphone. We were supposed to see such a thing by the end of this year, but instead we've been told to expect it early in 2012.

Err...

Lower power consumption please

qcmadness

引用:

原帖由 Henry 於 2011-9-20 20:01 發表
Size同iP4差唔多,都算OK.
係就快D出.

食電量的確幾令人在意.

size同Apple-a5差唔多?

qcmadness

引用:

原帖由 Henry 於 2011-9-20 20:43 發表

睇Anandtech張圖就係.

Apple A5係122mm^2, 太大了

我對Intel / AMD的low-power SoC期望係80-100mm^2 (Intel@32nm, AMD@28nm)

qcmadness

引用:

原帖由 Henry 於 2011-9-20 20:48 發表

我話部機.

呢個係封裝je

qcmadness

引用:

原帖由 Henry 於 2011-9-20 21:16 發表

Intel要努力縮U先得.

唔怕wor, 45nm / 40nm的Lincroft (Intel Atom Z6xx) / Zacate (AMD Z-01)先65 / 75mm^2
加埋SB, 縮到32nm / 28nm

我有信心die size細過100mm^2, 壓低耗電仲重要

qcmadness

引用:

原帖由 Henry 於 2011-9-20 21:59 發表

仲細粒過ARM.....

人地有baseband / wifi module
點同

qcmadness

引用:

原帖由 Henry 於 2011-9-20 22:03 發表

之前Intel都好似買落D Baseband既野.....
WiFi module,內置Intel WiFi就...

但係睇落呢1-2年都唔會integrate落atom度