引用:
Originally posted by qcmadness at 2009-9-20 13:51:
RV810 (32nm @ TSMC?): ~40-50 mm^2
RV830 (32nm @ TSMC?): ~110-130 mm^2
RV840 (40nm @ TSMC): ~180-220 mm^2
RV870 (40nm @ TSMC): ~330mm^2 (confirmed?)
成本低到咁
Ref.:
RV770 (55nm @ ...
confirmed
題外：可肯定GT300皮已收，之前良率傳聞確認屬實。
