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[業界消息] TSMC plans NT$21.6 billion bond sale

TSMC plans NT$21.6 billion bond sale

https://www.digitimes.com/news/a20200407VL202.html
引用:
TSMC's board of directors on April 6 approved the issuance of NT$21.6 billion (US$715.8 million) in unsecured corporate bonds to fund the construction of new facilities and equipment, according to a company filing with the Taiwan Stock Exchange (TWSE).

TSMC in March already raised NT$24 billion through the sale of unsecured corporate bonds. Earlier in 2020, TSMC disclosed plans to issue up to NT$60 billion of unsecured corporate bonds in Taiwan to finance its capacity expansion and/or pollution prevention related expenditures.

TSMC has estimated capex for 2020 at US$15-16 billion, up from the US$14.9 billion allocated in 2019. As high as 80% of the 2020 capex will be used for the development of the foundry's advanced process nodes including 7nm, 5nm and 3nm.

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